5G Networking, HPC/AI and Automotive 2.0 are driving unprecedented industry growth, along with massive increases in bandwidth, frequency and density requirements. The complexities of the resulting system architectures have intensified demand for advanced production test systems for semiconductors, module hardware, connectors and cables.
Samtec.offers a broad range of high-performance connectivity solutions ideal for many of these next generation test platforms. In addition, because we internally develop high-level test hardware for our own products, we have a unique understanding of the challenges and demands of advanced test instrumentation connectivity.
Samtec.offers a broad line of cost-effective, high pin count, extreme performance / density, and high mating cycle interconnect solutions, ideal for a wide range of high-performance test platforms.
The Intel High-Speed Mezzanine Card (HSMC) specification allows for a flexible design approach to interoperable motherboards and mezzanine cards of various manufacturers. By defining both the electrical and mechanical properties of the adapter, HSMC brings a standardized approach to a modular architecture. HSMC Cable Assemblies can connect two carrier cards together for debugging, or extend the reach between a carrier card and daughter card for application-specific test environments.
半导体components continue to grow in complexity, shrink in size and increase in performance. Testing ICs at the system level requires dense, high-speed modular test fixtures.
Searay.™High-Density Arrays and Cable Assemblies are ideally suited for such applications. Large I/O counts, ease of routing, 56 Gbps PAM4 performance and mix-and-match configurations simplify the design of modular test fixtures.
In test, individual storage drives attach to single-board computers (SBCs) connected to a test server. Connections between the SBCs and test servers utilize the latest high-performance protocols in a small area.