triangle alertNOTICE: We are currently performing maintenance on our account systems. Some accounts may not be available. If you need assistance, please contact customer service using the information that can found on the bottom of the website.×
triangle alertNOTICE: We are currently performing maintenance on our account systems. Some accounts may not be available. If you need assistance, please contact customer service using the information that can found on the bottom of the website.×

Mezzanine Systems for Next Gen Speeds

Samtec.helps address the challenges of next generation data rate requirements with industry-leading interconnect expertise, along with full system optimization services and support, including a vast library of development platforms and evaluation kits for high-performance interconnect systems. Samtec’s expanding line of proven High-Speed Mezzanine solutions engineered for 28 / 56 Gbps speeds includes extreme density arrays and ultra-high-density strips, along with optional mating cable systems.


Novaray®.56 Gbps NRZ Arrays

Novaray®.Extreme Density Arrays are optimized for the demands of 56 Gbps systems and beyond, with a roadmap to 112 Gbps PAM4. Attributes include low crosstalk, tight impedance control and industry-leading data rates and density. Cable systems are also available.

Extreme Density Arrays & Cables

AcceleRate® HD 56 Gbps Strips

Accelerate®HD超高密度,多排带令人难以置信的密集,最多240个总I / O,宽度5毫米宽,5毫米堆叠高度。EDGERate®触点针对信号完整性进行了优化,并实现了56 Gbps PAM4(28 Gbps NRZ)应用的支持。

Ultra-High-Density Multi-Row Strips on 0.635 mm Pitch

SEARAY™ High-Density Arrays

SEARAY™ Open-Pin-Field Arrays enable maximum grounding and routing flexibility; Low Profile & Ultra High-Density designs are also available. SEARAY™ VITA 57.1 FMC / VITA 57.4 FMC+ connectors are engineered to aid in application development.

开放式磁场阵列,Vita 57.1 FMC&VITA 57.4 FMC +

Development Platforms

Microsemi® PolarFire™ Evaluation Kit

Ideal for high-speed transceiver evaluation, 10 Gb Ethernet, IEEE1588, JESD204B, SyncE, SATA and more, the Microsemi® PolarFire™ Evaluation Kit leverages Samtec’s SEARAY™ VITA 57.1 FMC connectors. Features include:

  • 通过高引脚数(HPC)FPGA夹层卡(FMC),众多SMAS,PCIe®,双千兆以太网RJ45,SFP +和USB连接
  • Mating connectors for the mezzanine card include ASP-134488-01 for 10 mm stack and ASP-134602-01 for 8.50 mm stack

View additional details

Microsemi® PolarFire™ Evaluation Kit

FMC / FMC+ Development Kits & Boards

Samtec.offers a variety of development kits and boards featuring SEARAY™ VITA 57.1 FMC and VITA 57.4 FMC+ connectors that are designed to help simplify design and reduce time to market.


FMC / FMC+ Development Kits & Boards


Samtec.Signal Integrity Evaluation Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations. Custom kits are also available.

查看详细信息或联系 the current list of available kits.



Novaray®.Novaray®.112 Gbps PAM4, Extreme Density Arrays

Novaray®将112 Gbps PAM4的极端密度和性能相结合,每个通道比传统阵列减少40%。

  • 每频道112 Gbps pam4
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
  • 112 differential pairs per square inch
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
  • NVAM
  • NVAF
  • GPSO
  • NVAC
  • NVAM-C.

AcceleRate® HDAccelerate®HD超密集的多排夹层条带


  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height
  • 修身5毫米宽
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • 支持56 Gbps PAM4(28 Gbps NRZ)应用程序
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights in development
  • ADM6.
  • ADF6
  • GPSO
AcceleRate® HD

SEARAY™SEARAY™ High-Density Open-Pin-Field Arrays

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • 开放式针域设计中最多可达560个I / O.
  • 1.27 mm(.050“)音高
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • 符合扩展Life Product™(E.L.P.™)标准
  • 7 - 18.5 mm stack heights
  • 垂直,直角,压配合
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F,电子组件的可接受性 - 满足高性能/苛刻环境电子产品的3级可接受性标准(仅限接缝/ SeaF系列)
  • Seaf-ra.
  • 接缝-RA
  • 接缝
  • 接缝P
  • SEAR
  • 海水
  • 接缝I
  • JSO
  • GPPK
  • GPSK.

LP Array™LP Array™低轮廓开销场高密度阵列

这些较低的轮廓开口阵列阵列为4 mm堆叠高度,高达400个总I / O.

  • 4毫米,4.5毫米,5毫米堆叠高度
  • 高达400 I / O
  • 4,6和8行设计
  • .050“(1.27毫米)间距
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 性能高达18.5 GHz / 37 Gbps
  • LPAF
  • LPAM
  • JSO
LP Array™

Enough of the letter “P” already. Message recieved. In any case, modeling and simulating next-gen 224 Gbps signal channels poses many challenges. Design engineers must optimize the entire signal path, not just a specific component. The signal path includes transceiver and receive...
Samtec.和Glenair® announced a strategic partnership targeting rugged, high-density, high-performance fiber optic cable solutions for mil/aero applications. Next-generation military systems demand optimized SWaP-C for increased performance, longer mission life and cost effective...
As a NASA flight enthusiast, the idea of unmanned aerial vehicle systems (also known as drones) sounds like a lot of fun. A good example of how fun drones can be is through drone racing…yes you read that right… drone racing! However, apart from how fun they can be, drones have so...
The aerospace industry has had a tough time over the last 12 months. Not only has the commercial aviation market suffered severely from the effects of the COVID-19 pandemic, but the industry has not been able to showcase its latest developments. The signs of a recovery are beginn...