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高速背板

下一个Gen Speeds的高速背板

Samtec.helps address the challenges of next generation data rate requirements with industry-leading interconnect expertise, along with full system optimization support, including a vast library of development platforms and evaluation kits for high-performance interconnect systems. Our high-performance ExaMAX®Backplane Systems are engineered to achieve up to 56 Gbps performance and include connectors and cable assemblies that provide the option to optimize density or minimize board layer count.

Overview

考试®传统连接器

Enabling 56 Gbps electrical performance, ExaMAX®垂直标头和直角插座满足包括PCI Express(包括PCI Express)的行业规格®和Ethernet, and feature a reliable two-point contact system on 2.00 mm pitch. Guide / power modules also available.

考试传统

考试®直接伴侣正交

考试®直接伴侣正交标头和直角插座上的2.00 mm间距消除了对背板/中平面的需要,减少所需的连接器数,同时改善气流并缩短信号路径以增强信号完整性。

examax directmate

考试®背板电缆徳赢真人娱乐场

考试®高速背板电缆系统利用Samtec的眼睛速度®Ultra Low Skew Twinax Cable technology for improved signal integrity, increased flexibility and routability. The system is highly customizable and helps reduce cost with lower layer counts.

Examax HSBackplane.

开发平台

Xilinx®V.一世rtex®超自然FPGA VCU110 Development Kit

  • VCU110开发板和考试的组合®Loopback Card提供了一个平台,用于通过Samtec的Everax从FPGA展示28个Gbps性能®背板连接器系统
  • 八28 Gbps GTY MGT通过考试从FPGA路由®连接的连接器对,回到FPGA
  • 该套件通过Samtec的最后一英寸演示了优化的信号完整性性能®BOR PCB跟踪EBTM连接器的路由
  • 考试®equipped channels meet the IEEE 802.3bj mandated loss performance of 25 db
  • 通过Samtec的最终英寸优化SI性能®BOR PCB跟踪路由
  • 访问samtec.com/standards/fpgavcu110for additional details
examax Reltangle.

SI评估套件

Samtec.Signal Integrity Evaluation Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations. Custom kits are also available.

查看详细信息samtec.com/kits或联系kitsandboards@samtec.com.for the current list of available kits.

考试信号完整性

家庭

examax®.Revex®高速背板系统

Revex®高速背板互连提供56 Gbps电气性能。

Features
  • 在2.00 mm列间距上启用56 Gbps电气性能
  • 允许设计人员优化密度或最小化板层计数
  • 即使受到角度交配,也是两个可靠的接触点
  • Meets Telcordia GR-1217 CORE specification
  • 具有交错差分对设计的单个信号晶片;72或40对
  • 每个信号晶圆上的一件压花地面结构,以减少串扰
  • 市场上最低的配合力量:每次联系0.36 n max
  • 背板电缆组件提高了信号完整性,并以更高的数据速率提高信号路径长度
  • Samtec.’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • 存根交配
  • 按Fit终止
  • Power and Guide Modules available
产品
V.
  • EBTM
  • EBTM-RA.
  • EBTF-RA
  • EBDM-RA.
  • ebcm.
  • EBCF.
  • egbm.
  • EGBF.
  • EPTT.
  • epts.
  • eBCL.
  • EBCB.
examax®.

XCede® HDXcede®HD高密度背板系统

小型高密度背板系统理想的密度关键应用,采用模块化设计和可选功能,可用于灵活性和可定制的解决方案。

Features
  • 小型系数提供了显着的节省空间
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80毫米柱间距
  • 3-,4和6对设计
  • 4,6或8列
  • 12 - 48对
  • 多个信号/接地引脚分期选项
  • 可提供综合电源,指导,键口和侧壁
  • 85 Ω and 100 Ω options
  • 三个级别的测序使热插拔能够热插拔
  • 经济高效的设计可用于低速应用
产品
V.
  • HDTF.
  • HDTM.
  • BSP.
  • HPTS.
XCede® HD

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