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Micro Backplane Systems

Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.


Edge Rate®Edge Rate® Rugged, High-Speed Connector Strips

崎岖不平的边缘率®contact systems optimized for signal integrity performance.

特征
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • 在未发布的“拉链”时强大
  • 到56 Gbps PAM4性能
  • 0.50 mm,0.635 mm或0.80 mm间距系统
  • 堆叠高度从5 mm到18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Products
V
  • ERM8
  • ERF8.
  • ERM8-RA
  • ERF8.-RA
  • ERM8-EM
  • ERF8.-EM
  • ERM5.
  • ERF5.
  • ERF5-RA.
  • ERF6.
  • ERM6.
Edge Rate®

High-Speed Edge CardHigh-Speed Edge Card

具有坚固的边缘速率®联系人的高速边缘卡插座。

特征
  • Performance: Up to 18.5 GHz / 37 Gbps
  • 崎岖不平的边缘率®contacts
  • Card slot: 1.60 mm (.062")
  • Single-ended and differential pairs
  • Vertical, right-angle, edge mount
  • 可选板锁和电缆锁定功能
  • Optional weld tab for mechanical strength
  • ru8.system for elevated board stacking
Products
V
  • HSEC8-DV
  • HSEC8-RA
  • HSEC8-EM
  • HSEC8-PV
  • ru8.
  • HSC8.
High-Speed Edge Card

1.00 mm Pitch High-Speed Edge Card1.00 mm Pitch High-Speed Edge Card

1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.

特征
  • Performance up to 14 GHz / 28 Gbps
  • 崎岖不平的边缘率®contacts decrease crosstalk and increase cycle life
  • 20.– 140 total pins
  • 接受.062“(1.60毫米)厚牌
  • Optional weld tab and alignment pin
Products
V
  • HSEC1-DV
1.00 mm Pitch High-Speed Edge Card

Micro Edge Card SystemsMicro Edge Card Systems

微观间距边缘卡插座,各种中心线和方向。

特征
  • Performance: Up to 14.5 GHz / 29 Gbps
  • Solutions适用于.062“(1.60毫米),和.093”(2.36毫米)厚卡
  • Choice of pitch: 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, 2.00 mm
  • Available in surface mount and through-hole
  • Vertical, right-angle, edge mount
Products
V
  • MEC8-DV
  • MEC8-VP.
  • MEC8-RA.
  • MEC8-EM
  • MEC6-DV
  • MEC6-RA
  • MEC1
  • MEC1-RA
  • MEC1-EM
  • MECF-DV
  • MEC2-DV
  • MEC5-RA
  • MEC5-DV
Micro Edge Card Systems

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec QRate®连接器具有超薄占地面积,整体电源/接地平面和EdgeRate®联系人,可实现卓越的SI性能。

特征
  • 性能:高达15 GHz / 30 Gbps
  • 崎岖不平的边缘率®contacts
  • Integral ground/power plane
  • 最多156个职位
  • Slim footprint (less than 5.00 mm wide)
Products
V
  • QRF8.
  • QRM8
  • QRF8-DP.
  • QRF8.-RA
  • QRM8-DP
  • QRM8-RA
Q Rate®

Q Strip®QTrip®高速互连

Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential

特征
  • Performance: Up to 14.0 GHz /28 Gbps
  • Integral ground/power plane
  • 连接器到连接器保留选项
  • Vertical, perpendicular, and coplanar applications
  • 联系方式:最多180个I / O
  • Stack height: 5.00 mm - 25.00 mm
Products
V
  • QSH.
  • Qth.
  • QSS.
  • QTS.
  • QSE.
  • QTE.
  • QTS.-RA
  • QSS.-RA
Q Strip®

Q2™Q2™ Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

特征
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • 堆叠高度:10.00 mm - 16.00 mm
Products
V
  • QFS
  • QMS
  • QFS-DP
  • QMS-DP
  • QFS-RA
  • QMS-RA
  • QFS-EM
  • qms-em
  • QFS-PC
  • QMS-PC
  • QFSS
  • QMSS
  • QFSS-DP
  • QMSS-DP.
  • QFSS-PC.
  • QMSS-PC
  • QFSS-DP-PC
  • QMSS-DP-PC
Help Me Choose?
Q2™

sAY™Searay™高密度开销场阵列

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

特征
  • Maximum routing and grounding flexibility
  • 降低插入/提取力与典型阵列产品
  • 性能高达18 GHz /对
  • Up to 560 I/Os in open pin field design
  • 1.27 mm (.050") pitch
  • 崎岖不平的边缘率®contact system
  • 在交配/未用时可以是“拉链”
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 18.5 mm堆叠高度
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Products
V
  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • 煤层
  • SEAFP
  • SEAFP-RA
  • s
  • Seami.
  • JSO
sAY™

当他们听到医疗应用的短语连接器时,大多数电子类型都会考虑某种类型的I / O互连,以适应手持设备上的电缆接口。推拉电缆产品,圆形电缆组件和电线到板焊锡杯头和袜子......
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