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高速背板系统

High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.


XCede® HDXcede®HD高密度背板系统

小型高密度背板系统理想的密度关键应用,采用模块化设计和可选功能,可用于灵活性和可定制的解决方案。

Features
  • 小型系数提供了显着的节省空间
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80毫米柱间距
  • 3-, 4- and 6-pair designs
  • 4,6或8列
  • 12 - 48对
  • 多个信号/接地引脚分期选项
  • 可提供综合电源,指导,键口和侧壁
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Products
V.
  • HDTF.
  • HDTM.
  • BSP
  • HPTS
XCede® HD

ExaMAX®ExaMAX® High-Speed Backplane System

Revex®高速背板互连提供56 Gbps电气性能。

Features
  • 在2.00 mm列间距上启用56 Gbps电气性能
  • 允许设计人员优化密度或最小化板层计数
  • 即使受到角度交配,也是两个可靠的接触点
  • Meets Telcordia GR-1217 CORE specification
  • 具有交错差分对设计的单个信号晶片;72或40对
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • 市场上最低的配合力量:每次联系0.36 n max
  • 背板电缆组件提高了信号完整性,并以更高的数据速率提高信号路径长度
  • Samtec.’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • 存根交配
  • Press fit termination
  • Power and Guide Modules available
Products
V.
  • EBTM
  • EBTM-RA.
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • egbm.
  • EGBF.
  • EPTT.
  • epts.
  • EBCL
  • EBCB
ExaMAX®

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