三角戒备注意:我们目前正在对我们的帐户系统进行维护。有些帐户可能无法使用。如果您需要帮助,请使用网站底部的信息联系客户服务。×
三角戒备注意:我们目前正在对我们的帐户系统进行维护。有些帐户可能无法使用。如果您需要帮助,请使用网站底部的信息联系客户服务。×

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 56 Gbps PAM4 performance, XCede® HD high-density backplane solutions for design flexibility and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

High-Speed Backplane Systems

High-Speed Backplane Systems

高速,高密度背板系统包括各种对和列计数中的Examax®和Xcede®HD。Requeax®最高可达56 Gbps性能,并允许设计人员选择优化密度或最小化板层计数。Xcede®HD是一个小型系子系统,具有模块化设计,可节省高度空间和灵活性。


Xcede®HD.Xcede®HD.High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

特征
  • Small form factor provides significant space savings
  • 模块化设计在应用中提供灵活性
  • 高性能系统
  • 高密度背板系统 - 每线性英寸高达84个差分对
  • 1.80毫米的柱距
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85Ω和100Ω选项
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Products
V
  • HDTF
  • HDTM
  • BSP
  • HPTS
Xcede®HD.

ExaMAX®ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

特征
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • 符合Telcordia GR-1217核心规范
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec的EyeSpeed®超低偏斜Twinax电缆提供了更大的灵活性和可排卵
  • Stub free mating
  • Press fit termination
  • 可用的电源和指南模块
Products
V
  • EBTM.
  • EBTM.-RA
  • EBTF-RA.
  • EBDM-RA
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB
ExaMAX®

Micro Backplane Systems

Micro Backplane Systems

Micro backplane systems include high-speed edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects in a variety of pitch, orientation and termination.


EdgeRate®.边缘速率®坚固耐用,高速连接器条带

坚固的边缘速率®联系系统s optimized for signal integrity performance.

特征
  • EdgeRate®.contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • 在未发布的“拉链”时强大
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • 堆叠高度从5 mm到18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Products
V
  • ERM8.
  • ERF8
  • ERM8-RA.
  • ERF8-RA
  • ERM8.-EM
  • ERF8-EM
  • ERM5.
  • ERF5
  • ERF5-RA
  • ERF6
  • ERM6.
EdgeRate®.

High-Speed Edge CardHigh-Speed Edge Card

High-speed edge card sockets with rugged Edge Rate® contacts.

特征
  • Performance: Up to 18.5 GHz / 37 Gbps
  • 坚固的边缘速率®联系人
  • Card slot: 1.60 mm (.062")
  • Single-ended and differential pairs
  • Vertical, right-angle, edge mount
  • Optional board locks and cable latching features
  • 用于机械强度的可选焊接片
  • RU8 system for elevated board stacking
Products
V
  • HSEC8-DV
  • HSEC8-RA
  • HSEC8-EM
  • HSEC8-PV
  • RU8
  • HSC8
High-Speed Edge Card

1.00 mm间距高速边缘卡1.00 mm间距高速边缘卡

1.00 mm pitch high-speed edge card sockets with rugged Edge Rate® contacts and misalignment mitigation.

特征
  • 性能高达14 GHz / 28 Gbps
  • 坚固的边缘速率®联系人decrease crosstalk and increase cycle life
  • 20 - 140总引脚
  • Accepts .062" (1.60 mm) thick cards
  • Optional weld tab and alignment pin
Products
V
  • HSEC1-DV
1.00 mm间距高速边缘卡

微边卡系统微边卡系统

Micro pitch edge card sockets in a variety of centerlines and orientations.

特征
  • 性能:高达14.5 GHz / 29 Gbps
  • Solutions for .062" (1.60 mm), and .093" (2.36 mm) thick cards
  • 音高选择:0.50 mm,0.635 mm,0.80 mm,1.00 mm,1.27 mm,2.00 mm
  • 适用于表面贴装和通孔
  • Vertical, right-angle, edge mount
Products
V
  • MEC8-DV
  • MEC8-VP
  • MEC8-RA.
  • MEC8-EM
  • MEC6-DV
  • MEC6-RA
  • MEC1.
  • MEC1-RA.
  • MEC1.-EM
  • MECF-DV
  • MEC2-DV
  • MEC5-RA
  • MEC5-DV
微边卡系统

qRate®.qRate®.Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

特征
  • Performance: Up to 15 GHz / 30 Gbps
  • 坚固的边缘速率®联系人
  • 整体地面/电源平面
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Products
V
  • QRF8.
  • QRM8.
  • QRF8-DP.
  • QRF8-RA.
  • QRM8-DP.
  • QRM8.-RA
qRate®.

Q Strip®Q Strip® High-Speed Interconnects

Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential

特征
  • Performance: Up to 14.0 GHz /28 Gbps
  • 整体地面/电源平面
  • Connector to connector retention options
  • Vertical, perpendicular, and coplanar applications
  • 接触s: Up to 180 I/Os
  • Stack height: 5.00 mm - 25.00 mm
Products
V
  • QSH
  • QTH
  • QSS
  • QTS
  • QSE
  • QTE
  • QTS-RA
  • QSS-RA
Q Strip®

Q2™Q2™Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

特征
  • 性能:高达8.5 GHz / 17 Gbps
  • Increased insertion depth
  • 双级热插拔
  • 整体地面/电源平面
  • 屏蔽选项可用
  • 电源和RF结束选项
  • 接触s: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Products
V
  • QFS
  • QMS
  • QFS-DP
  • QMS-DP.
  • QFS-RA.
  • QMS-RA
  • QFS-EM
  • qms-em
  • QFS-PC.
  • QMS-PC.
  • QFSS.
  • QMSS
  • QFSS-DP.
  • QMSS-DP
  • QFSS.-PC
  • QMSS-PC.
  • QFSS-DP.-PC
  • QMSS-DP-PC
Help Me Choose?
Q2™

Searay™Searay™高密度开销场阵列

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

特征
  • 最大路由和接地灵活性
  • 降低插入/提取力与典型阵列产品
  • Performance up to 18 GHz/pair
  • Up to 560 I/Os in open pin field design
  • 1.27 mm (.050") pitch
  • 坚固的边缘速率®联系系统
  • Can be "zippered" during mating/unmating
  • 焊料充电终端以易于加工
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 18.5 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85欧姆系统
  • Vita 47,Vita 57,Pismo 2认证
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Products
V
  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • SEAMP
  • SEAFP
  • SEAFP-RA
  • SEAR
  • Seami.
  • JSO
Searay™

Enough of the letter “P” already. Message recieved. In any case, modeling and simulating next-gen 224 Gbps signal channels poses many challenges. Design engineers must optimize the entire signal path, not just a specific component. The signal path includes transceiver and receive...
In April, we continued improvements to our new similar parts functionality as well as our search upgrades, and released several new content product pages on the website. We’ll also piggyback some of the cart upgrades we’ve rolled out in the last few months onto this post. Continu...
Samtec和Glenair®宣布了针对MIL / AERO应用的粗糙,高密度,高性能光纤电缆解决方案的战略合作伙伴关系。下一代军事系统需求优化SWAP-C,以增加性能,更长的使命生命和成本效益......
As a NASA flight enthusiast, the idea of unmanned aerial vehicle systems (also known as drones) sounds like a lot of fun. A good example of how fun drones can be is through drone racing…yes you read that right… drone racing! However, apart from how fun they can be, drones have so...
航空航天行业在过去12个月中遇到了艰难的时光。商业航空市场不仅严重遭受了Covid-19大流行的影响,而且该行业还无法展示其最新发展。恢复的迹象开始......